Curing Oven – Clean Class 100
Inquire productC1-004
Industrial Curing Ovens are used by thermal processing specialists to improve the strength and durability of a material by applying heat to accelerate a desirable chemical reaction.
Usage: semiconductor packaging program segment, for resin curing
Max. working temperature 360°C, clean class 100.
Oxygen concentration less than 50ppm.
Program operation function, auto / manual mode.
Fast temperature rising and cooling, and air cooling or air cooling + water cooling are available for cooling method.
Equipped with auto lock, digital pressure gauge, digital flowmeter, etc.
Equipped with safety devices of auto overheat protector, overheat protector, abnormal N2 pressure, abnormal N2 flow, over-current earth leakage circuit breaker, etc.
- Applications
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- - semiconductor packaging program segment, for resin curing
- Technical specifications
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C1-004 Operating temperature rangeRoom temp. 30~360°CTemperature adjustment accuracy±4.0°C (at 360°C)Temperature rising time15min°C (Room temp.→360°C)Temperature cooling time60min (360°C→50°C)Clean class100 (at constant temp.)HEPA filterDust collection efficiency: 0.3um particle more than 99.97%Operation functionFixed temp., program operationConfigurationN2 introduction device, water cooling device, differential pressure gauge, etc.Internal dimension (WxDxH) - single chamber660 mm x 660 mm x 500 mmPower source3 phase AC380V 6A
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