Applications
- semiconductor packaging program segment, for resin curing
Curing Oven
C1-003
Industrial Curing Ovens are used by thermal processing specialists to improve the strength and durability of a material by applying heat to accelerate a desirable chemical reaction.
Usage: semiconductor packaging program segment, for resin curing
Available in 2/4/6-chamber combinations (independent control for each chamber).
Space saving.
Horizontal convection.
Fast temperature rising and cooling, with program operation function.
Equipped with auto lock, N2 flowmeter, temperature recorder, emergency stop switch, etc.
Equipped with safety devices of auto overheat protector, overheat protector, abnormal N2 pressure, abnormal N2 flow, over-current earth leakage circuit breaker, etc.
Technical specifications
| C1-003 | |
Operating temperature range | 40~260°C |
Temperature adjustment accuracy | ±5.0°C (at 175°C) |
Temperature rising time | 15 min (50°C→175°C) |
Temperature cooling time | 30min (175°C→50°C) |
Operation function | Fixed temp., program operation |
Configuration | Air exhaust actuator, N2 introduction device, recorder, etc. |
Internal dimension (WxDxH) - single chamber | 450 mm x 520 mm x 300 mm |
Power source | 3 phase AC380V 6A |
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