Applications
- semiconductor packaging program segment, for resin curing
Curing Oven - Clean Class 100
C1-004
Industrial Curing Ovens are used by thermal processing specialists to improve the strength and durability of a material by applying heat to accelerate a desirable chemical reaction.
Usage: semiconductor packaging program segment, for resin curing
Max. working temperature 360°C, clean class 100.
Oxygen concentration less than 50ppm.
Program operation function, auto / manual mode.
Fast temperature rising and cooling, and air cooling or air cooling + water cooling are available for cooling method.
Equipped with auto lock, digital pressure gauge, digital flowmeter, etc.
Equipped with safety devices of auto overheat protector, overheat protector, abnormal N2 pressure, abnormal N2 flow, over-current earth leakage circuit breaker, etc.
Technical specifications
| C1-004 | |
Operating temperature range | Room temp. 30~360°C |
Temperature adjustment accuracy | ±4.0°C (at 360°C) |
Temperature rising time | 15min°C (Room temp.→360°C) |
Temperature cooling time | 60min (360°C→50°C) |
Clean class | 100 (at constant temp.) |
HEPA filter | Dust collection efficiency: 0.3um particle more than 99.97% |
Operation function | Fixed temp., program operation |
Configuration | N2 introduction device, water cooling device, differential pressure gauge, etc. |
Internal dimension (WxDxH) - single chamber | 660 mm x 660 mm x 500 mm |
Power source | 3 phase AC380V 6A |
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